Dowsil 3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and also for bonding printed circuit boards to substrates. The 3-6751 adhesive is a gray, two-part kit that is heat curable with a UL94 V-0 rating. The low viscosity, low modulus quality of Dow 3-6751 allows a more intimate adhesion providing a longer time of functionality in a wide variety of extreme service environments maintaining a low stress environment on the electronic assemblies, significantly enhancing the reliability of the part. Application methods for the Dowsil 3-6751 include both manual and automated meter-mix and dispensing. More information including the technical data sheet and MSDS can be obtained through Krayden, Inc. Authorized Distributor for Dow.