Henkel’s TECHNOMELT AS 4226 Low-Pressure Moldable Hot Melt
Henkel has produced the transparent TECHNOMELT AS 4226 that uses Synthetic Copolymer technology as a solution for molding applications that require optical clarity. This low-pressure molding material offers ease-of-use, and can accommodate sensitive components and circuitry. TECHNOMELT AS 4226 is a practical one-component substitute for the traditional potting process, and can be utilized throughout a wide range of sensors in the consumer electronics, automotive, lighting, and industrial sectors. Before using this material, it is necessary to read the Material Safety Data Sheet for information regarding precautionary measures and safety recommendations.
The softening point of Hot Melt TECHNOMELT AS 4226 is 165°C, and its elongation is 250%. The working temperature for this material is -40 to 85°C, and the low storage temperature is -40°C. Glass transition is at -15°C, and the temperature creep resistance is at 110°C. The application system for Hot Melt TECHNOMELT AS 4226 is an extrusion and injection molding process, and the application temperature is between 160 and 220°C. The Break Strength for this product is 10 N/mm², Yield Strength is 5 N/mm², and Shore D hardness is 45. For further information or application methods, please contact an experienced Krayden Technical Representative, or see Henkel’s TECHNOMELT AS 4226 TDS.
TECHNOMELT AS 4226 Moldable Hot Melt Typical Properties:
|Melting Viscosity at 210°C, mPas||45,000|
|Shore D Hardness||45|
|Yield Strength, N/mm²||5|
|Break Strength, N/mm²||10|
|Temperature Creep Resistance||110°C|
|Working Temperature||-40 to 85°C|
TECHNOMELT AS 4226 Clear Moldable Hot Melt is a watertight encapsulant that offers good adhesion to PCBs and has a low moisture uptake. Minimal color or clarity change will occur after long-term exposure to UV light, making this thermal plastic material a great option for industrial components and in-cabin automotive sensors. TECHNOMELT AS 4226 Clear Moldable Hot Melt has excellent sealing adhesion, solvent resistance, and is ideal for sensitive electronic components due to its low application temperatures.
Heat above the suggested temperature range should not be applied to TECHNOMELT AS 4226. Overexposure to higher than recommended temperatures will cause the material to become discolored and will degrade its quality. Exposure to heat for extensive periods of time should also be avoided. For good wetting, the use of a specific application temperature is required when bonding to a substrate with high thermal conductivity. TECHNOMELT AS 4226 should be stored in a cool and dry location, with its container tightly closed when not in use.
Hot Melt TECHNOMELT AS 4226 low-pressure molding solution delivers simplicity of use with a short cycle time, and an ability to keep from damaging fine or fragile circuitry. This developed material provides a significant improvement over that of traditional potting or encapsulating processes with operation taking place at low pressures. For additional assistance with handling precautions for Hot Melt TECHNOMELT AS 4226 please contact Krayden, an authorized distributor of Henkel products.