Thermally Conductive Adhesive 3-6751 by Dow
Dowsil 3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and also for bonding printed circuit boards to substrates. The 3-6751 adhesive is a gray, two-part kit that is heat curable with a UL94 V-0 rating. The low viscosity, low modulus quality of Dow 3-6751 allows a more intimate adhesion providing…