Thermally Conductive Adhesive 3-6751 by Dow

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Dowsil 3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and also for bonding printed circuit boards to substrates.  The 3-6751 adhesive is a gray, two-part kit that is heat curable with a UL94 V-0 rating.  The low viscosity, low modulus quality of Dow 3-6751 allows a more intimate adhesion providing…