Thermally Conductive Adhesive 3-6751 by Dow

Dowsil 3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and also for bonding printed circuit boards to substrates.  The 3-6751 adhesive is a gray, two-part kit that is heat curable with a UL94 V-0 rating.  The low viscosity, low modulus quality of Dow 3-6751 allows a more intimate adhesion providing…

Heat Sink Compound 340 by Dow

The high thermal conductivity of the Dow Corning 340 Heat Sink Compound also offers low bleed benefits and is stable at high temperatures. The 340 compound is used on aircraft engines, LED applications, to mount studs of transistors, diodes and silicon-controlled rectifiers, and also serves as a thermal coupler for many heat sink devises. The…