Innovative Low-Pressure Molding Technology
As the electronics industry continues to grow, the requirement for electronics manufacturers to effectively protect the fragile parts that make up their products grows as well. As a result of this trend, Low Pressure Molding (LPM) has become an increasingly popular alternative to most traditional potting processes. This advanced method of electronic encapsulation is an overmolding process that involves less time, lower temperatures, and requires little pressure. Developed in the 1970’s by Henkel Corporation, Low Pressure Molding was originally utilized to improve the overall potting process for components found in the Automotive industry. With the increasing importance of PCB and circuit board protection, the use of LPM has spread to protect many different products found in the medical, military, lighting, industrial, and consumer industries as well. Today, LED Lighting protection could be considered a primary application for Low Pressure Molding, and Henkel’s TECHNOMELT brand is a leader in the market.
Low Pressure Molding utilizes environmentally friendly thermoplastic materials to encapsulate fragile electronic components. This simple process protects delicate circuitries from environmental damage.
Low Pressure Injection Molding Technology begins with applying heat to thermoplastic polyamide materials, or “hot melts,” until they are in liquid form. The liquefied molding compounds are then able to take the form of the mold they are injected into, encapsulating the electronic parts in need of protection. The material is then left to cool and solidify into the desired shape. The major differentiating factor of polyamide material is its ability to be liquefied at low temperatures and injected using very little pressure. Low Pressure Injection Molding Technology allows the encapsulating process to take place without damaging the delicate electronic components it was designed to protect.
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While customary potting methods can require up to 8 individual steps before completion, Low Pressure Molding Material has reduced the process down to one-step. Adopting Low Pressure Molding as a solution to encapsulation requirements will ultimately lower a business’s cost of ownership, and will significantly increase their total throughput. This material provides fragile electronic components with environmental protection from vibration and moisture while also allowing for more customizable designs, and what most would consider a more attractive look. Low Pressure Molding Material also offers the benefit of an environmentally friendly business practice.
Lessening the toll that the environment takes on components encased by Thermoplastic Hot Melts is not the only advantage gained by utilizing Low Pressure Molding. In return, LPM has proven to minimize the negative effect that the encapsulation process has on the environment itself, as most materials used during this process are derived from natural ingredients. All leftover scraps and substances are biodegradable or renewable, thus minimizing environmental pollution. Energy consumption is also dramatically reduced when switching from a traditional potting process to Low Pressure Molding.
Low Pressure Thermoplastic Molding is a one-step procedure designed to effectively encase and shield fragile electronic components from environmental elements. Unlike some outdated potting processes, LPM requires significantly less material to provide delicate circuitries with excellent sealing adhesion, and temperature and solvent resistance. This method offers complete watertight encapsulation, and enables custom designs that can even include Logos or part numbers. With no required cure process, the amount of time consumed in order to complete Low Pressure Molding is considerably less when compared to traditional techniques, leaving the encapsulation process substantially more lean.
