Loctite 3515 is a heat cure, epoxy material used for adhering or bonding SMD components to PCB. This innovative product is designed to allow self-alignment of SMT components during the reflow process. The material will be fully cured in 30 minutes at a temperature of 150 degrees Celsius. High speed heat cure at a temperature of 220 degrees Celsius will only take approximately 15 seconds.
Loctite 3515 Epoxy is a black paste, one component product that is specifically designed as a re-workable underfill for CSP. This product is dispensed by a syringe to the circuit board on the corners of the pad. The assembly process will speed up because it eliminates the post-reflow underfill cure and dispense steps. Loctite 3515 has good on-board electrical characteristics; good dot profile, and has great dispensing characteristics. The specific gravity at a temperature of 25 degrees Celsius is 1.23 and the yield point is estimated to be 300 to 750 at the same temperature.
The Loctite material is formulated to cure during the solder reflow process forming a strong bond contributing to improvements to hand held device reliability. This product meets the highest environmental resistance and reliability standards. It meets the hydrolytic stability testing to IPC-TM-650 2.6.11 class 3. All material will be delivered with cold gel packs to maintain temperatures below 8 degrees Celsius during transit. Once Loctite 3515 is delivered, it is recommended to bring it back to ambient conditions by allowing it to stand at room temperature for approximately 1 to 2 hours. Depending on the size of the package will determine the actual time required to bring back to room temperature.
It is extremely important to understand the proper handling information and the requirements for storage to ensure the material will provide optimal characteristics when used. Loctite 3515 is recommended to be stored between the temperatures of 2 to 8 degrees Celsius. Anything above or below the temperatures can affect the properties of the product. Loctite 3515 epoxy should be stored in a dry location in its unopened container. Once the material is removed, it is strongly recommended to not return the product back into the container. It may have become contaminated during use. It is important to not return the Loctite to refrigerated storage. Any surplus of the epoxy should just be discarded. For more information in regards to this advanced epoxy adhesive, refer to the Loctite 3515 MSDS.
Loctite 3515 is an advanced epoxy paste formulated for bonding or underfilling electronic components. Henkel is recognized globally for manufacturing ground-breaking materials for a variety of industries. Loctite 3515 Epoxy has been designed to cure quickly providing a tough bond in portable electronic devices. If more information is required about the application methods or sizing of Loctite 3515, contact Krayden, Inc., a specialized distributor of Henkel adhesives, sealants and specialty chemicals. More information is provided on the Loctite 3515 TDS.
