Loctite 383 thermally conductive adhesive is a system aimed at connecting heat manufacturing components to heat sinks. It provides outstanding heat dissipation for very thermally delicate components. Loctite 383 thermal adhesive also provides high structural strength to many electronic assemblies. It is typically used for the bonding of transistors, transformers, and other heat generating electronics to printed circuit…
DOWSIL TC-2022, formerly Dow Corning TC-2022, is a single component, high tensile strength, thermally conductive adhesive. The innovative product requires no mixing, has no added solvents, can be used with heat-sensitive substrates and components. Dow TC-2022 is suitable for bonding integrated circuit boards, heat sink attach, adhering lids and housings. The adhesive is composed of…
Dowsil PR-1205 (Formally Dow Corning PR-1205) is a one-part RTV prime coat that enhances the bonding and adhesion of heat cure and RTV silicones to many ceramics, plastics, and metals. This primer is a dilute solution of saline coupling agents and other active ingredients. The use of solvents in this product helps deliver the active…
DOWSIL 832, formerly known as Dow Corning 832, is a single component, neutral cure, low odor, multi-surface adhesive sealant used to bond and seal a wide variety of substrates where unprimed adhesion or non-corrosive sealant is required. The typical applications well suited for this product includes sealing and repairing gutters, roof penetrations, marine equipment, windows,…
DOWSIL1-4174, formerly Dow Corning 1-4174, is a single component, flowable, gray, thermally conductive adhesive with high tensile strength, and no added solvents. The innovative silicone adhesive comes with 7 mil glass beads (178 micron) allowing for uniform, and easily controlled bond line thickness. DOWSIL1-4174 is the same product as DOWSIL1-4173, but DOWSIL1-4174 includes the 7…
NanoSlic Coating from FCT Assembly, is the next generation in surface protection to improve the durability and performance of substrates in a variety of industries. NanoSlic Ceramic, which is both hydrophobic and oleophobic, will chemically bind to the substrate. Once it binds, the chemical composition forms a thin layer that prevents degradation by repelling water…
Dow Corning 737 RTV neutral cure clear sealant is a non-slumping, one-component, fast cure paste that offers the user exceptional adhesion to many plastic, glass, metal, rubber, and painted surfaces. With that connection, the adhesive doesn’t react with or corrode most plastics or metals; with a few exceptions in some not so standard applications. The…
The all-new, single component, solvent free, Permabond JP217801 Cationic Epoxy is designed to bond a wide variety of substrates including plastic, metal, ceramic, and glass substrates. The innovative material is composed of a cationic single component epoxy, and it will cure in shadow areas. JP217801 offers little to no shrinkage during cure and little to…
HumiSeal UV92 is a single component, UV curable, soft masking material providing a temporary barrier to stop the entrance of conformal coatings into unwanted areas.This innovative masking material offers outstanding solvent resistance that provides selective release from conformal coatings. The coating has an operating temperature ranging between -50 to 150°C. UV92 is available in 30CC,…
Dow Corning TC-3040 Thermally Conductive Gel Dow Corning TC-3040 is a single-component, heat curable, thermally conductive gel used in microelectronics thermal interface applications. This product exhibits high thermal conductivity, has improved heat dissipation, and enables reliable performance. It offers versatile curing options and is composed of polydimethylsiloxane. Application methods include manual or automated. The color…
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