Dow Corning TC-3040 Thermally Conductive Gel Dow Corning TC-3040 is a single-component, heat curable, thermally conductive gel used in microelectronics thermal interface applications. This product exhibits high thermal conductivity, has improved heat dissipation, and enables reliable performance. It offers versatile curing options and is composed of polydimethylsiloxane. Application methods include manual or automated. The color…
Cytec Conathane EN-2550 Polyurethane Resin System Cytec Conathane EN 2550 has been designed for encapsulating or potting electronic devices, as well as casting high-voltage transformers. This two-part polyurethane resin system displays good working life, minimum processing hazards, and great handling properties at room temperature. Without forming voids, Cytec Conathane EN 2550 can be cured at…
Cytec Conathane EN-2521 Polyurethane Resin System Ideal for potting applications where exceptional performance is required in temperatures ranging from -65 to 130°C, Cytec EN-2521 is a two component, filled polyurethane resin system. It is an excellent choice for encapsulation of strain sensitive circuitry, modules, coils, and transformers. This innovative product offers good electrical properties and…
Huntsman CG-1305 A/B is a pourable, medium density resin/ hardener system that has been designed to aid in creating strong and durable reinforcements throughout aircraft production. The use of this material is not limited to aircraft production, and can also be utilized in other industrial applications that require a low weight, high-strength resin system. Due…
Innovative Low-Pressure Molding Technology As the electronics industry continues to grow, the requirement for electronics manufacturers to effectively protect the fragile parts that make up their products grows as well. As a result of this trend, Low Pressure Molding (LPM) has become an increasingly popular alternative to most traditional potting processes. This advanced method…
Huntsman’s Epocast 1622 FST A/B has been designed for applications in need of high grade flammability resistance as well as low toxicity and low smoke density. This material is a two-component, pumpable epoxy syntactic that is easily extruded through Semco dispensing nozzles. Epocast 1622 FST A/B does not flow after it has been applied and…
Henkel’s TECHNOMELT AS 4226 Low-Pressure Moldable Hot Melt Henkel has produced the transparent TECHNOMELT AS 4226 that uses Synthetic Copolymer technology as a solution for molding applications that require optical clarity. This low-pressure molding material offers ease-of-use, and can accommodate sensitive components and circuitry. TECHNOMELT AS 4226 is a practical one-component substitute for the traditional…
Loctite HC 3056 is a two component, low density, room temperature cure, epoxy paste adhesive. It is also known as Hysol TF 3056 Loctite HC 3056 Aero is a two component, low density, room temperature cure potting compound that is ideal for use in honey comb panels for edge close out, insert potting and smoothing.…
Dow Corning SE 4445 is a two component, thermally conductive, thermal interface silicone gel used for potting electronic devices Dow Corning SE 4445 is a two component, gray, thermally conductive, thermal interface wet dispensed polydimethylsiloxane gel. Density of the cured material is 2.36 g/cm3 and the viscosity is 15025 cP, 15025 mPa-sec and 15 pa-sec.…
Loctite EA 9313 Aero Loctite EA 9313 Aero, Formerly Hysol EA 9313 is a low viscosity, room temperature cure epoxy paste adhesive with excellent low temperature properties. Buy Loctite EA 9313 Aero Loctite EA 9313 Aero is a two component, room temperature cure, low viscosity epoxy paste adhesive. Some of the key features of this…
Copyright © 2017 Krayden, Inc.
