DOWSIL TC-2022, formerly Dow Corning TC-2022, is a single component, high tensile strength, thermally conductive adhesive. The innovative product requires no mixing, has no added solvents, can be used with heat-sensitive substrates and components. Dow TC-2022 is suitable for bonding integrated circuit boards, heat sink attach, adhering lids and housings. The adhesive is composed of polydimethylsiloxane and aluminum oxide.
Dow TC-2022 Features and Benefits:
- Heat flow away from electronic components can increase reliability
- Primerless adhesive to a variety of substrates
- heat curable at moderate temperatures
- No mixing required
- Good thermal conductivity
- No added solvents
The one-part thermally conductive adhesive requires no pre-treatment on substrates and it also provides excellent adhesion to a wide variety of materials including PBT, FR4, and AlClad. DOWSIL TC-2022 Thermally Conductive Adhesive improves cost effectiveness with rapid/low temperature cure, and can be used with heat-sensitive substrates and components. Viscosity is 190,000 Cp, thixotropy is 3.7, and specific gravity of the cured adhesive is 2.7. Heat cure time at 100°C is approximately 15 minutes. Cure time of this material can be accelerated with increase in temperature and time. DOW TC-2022 requires no mixing, and has no added solvents.
DOWSIL TC-2022 Thermally Conductive Adhesive Products
DOWSIL TC-2022 Thermally Conductive Compound 10 KG Pail
Thermal conductivity of Dow Corning TC-2022 is 1.7 W/m-K, unprimed adhesion lap shear (Al) is 600 psi. Thermally conductive silicones such as this Dow product will function as a heat transfer media, blocking against environmental contaminates, relieving shock and vibration. Dow TC-2022 will bond well to a wide variety of metal and plastic surfaces. To ensure maximum bond strength on your substrate, lap shear or similar adhesive strength test is required. DOWSIL TC-2022 should be operational at temperatures between -45 to 200°C for long periods of time. Anything above or below the stated temperatures will change the behavior of this silicone adhesive. For more information about Dowsil TC-2022, ASK AN EXPERT.
Reading the DOWSIL TC-2022 SDS and taking the appropriate precautions before handling is strongly recommended. Usable storage information and shelf life should be stated on the label. Dow TC-2022 is only intended to survive intermittent exposure to solvents or fuels. It is supplied with 7 mil glass beads for uniform thickness. Dow TC-2022 reduces mechanical clamping, offers low temperature cure for temperature sensitive components, and primerless adhesion to a wide variety of substrates. REQUEST A QUOTE.
DOWSIL TC-2022 is a gray, single component, thermally conductive, heat cure adhesive used to bond a wide assortment of substrates. Heat flow away from electronic components can increase reliability, and rapid to low temperature cure will improve cost effectiveness. More information can be found on the DOWSIL TC-2022 Technical Data Sheet.