Dowsil TC-4525 Thermally Conductive Gap Filler will take the heat out and leave performance in

Dowsil TC-4525 is a two component, room temperature cure, thermally conductive gap filler designed for automotive electronics. The innovative material has long-term performance stability during temperature cycling up to 150°C, withstands peak exposure at 200°C and holds vertical position cured or uncured. The product is a soft and compressible material once it is cured. It is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mixing equipment.

Dow TC-4525 Thermal Management Solution:

Easy Processing: The Advance material dispenses easily from its original package with minimal to no additional preparation. It is well suited for automated applications and meter mix equipment.

Improved Reliability in Harsh Temperatures: TC-4525 delivers high thermal conductivity of  2.5 W/m·K to effectively dissipate heat from sensitive electronics. It can withstand exposure up to 200°C.

Effective Assembly: The thermally conductive gap filler avoids slumping on vertical surfaces during assembly. It will maintain its vertical stability long after it has been cured.

Reduced Friction: The product is formulated to deliver much lower abrasiveness to help reduce maintenance.

UL 94 V-0: Dowsil TC-4525 has received recognition under UL 94 standard, which evaluates the flammability of plastic and silicone material.

Dow Corning TC-4525 Thermally Conductive Gap Filler Features and Benefits:

• Thermal Conductivity: 2.5 W/m·K
• Room Temperature Cure
• Long-Term Performance Stability During Temperature Cycling up to 150°C
• Withstands Peak Exposure at 200°C
• Holds Vertical Position (Cure and Uncured)
• Glass Beads Option (180 Micron)
• UL 94 V-0 Certification

Dowsil TC-4525 Thermally Conductive Gap Filler has a mixed viscosity of 217 Pa.s. The color of part A is white and part B is blue. Working time at 25°C is 40 minutes and cure time is 120 minutes. If the temperature is increased to 50°C the cure time will decrease to 20 minutes and at 80°C cure time will be 10 minutes. Dielectric strength is 18 kV/mm and the coefficient of thermal expansion -50 to 150°C is 123 ppm/K. It has treated alumina to enhance thermal conductivity while managing stability of bulk properties and it offers a platinum cure system for a fast controlled cure. Dow TC-4525 can be placed in service immediately at operating temperatures of -45 to 150°C following the completion of the cure schedule. Exposure at high temperatures up to 200°C is allowed for short periods of time.

Two-part material should be mixed in the proper ratio either by weight or volume. This product has a mix ratio of 1:1 by weight or volume. The presence of light-colored streaks or marbling indicates that the mixing of the material is inadequate. In addition to keeping their physical and electrical properties over a broad range of operating conditions, it offers good chemical stability and is resistant to ozone and ultraviolet degradation. Silicones have a low surface tension that enables them to wet most surfaces which can lower the thermal contact resistance between the material and the substrate. Dowsil TC-4525 cure reaction begins with the mixing process. It will be evident by a gradual increase in viscosity, followed by gelation and conversion to its final state.

Before handling the material Dowsil TC-4525 Thermally Conductive Gap Filler, it is strongly recommended to read and understand the Dowsil TC-4525 MSDS. Shelf life at room temperature is 180 days. Containers should be kept tightly closed to prevent moisture from coming in contact with the product. Any special storage and handling precautions will be printed on the product container. For more information on the material, contact Krayden, a certified distributor of Dow. More information can be found on the Dowsil TC-4525 TDS.

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