The epoxy resin, Circalok 6008 is a filled low viscosity used for general purposes as an encapsulating and potting compound for electronics. The LORD Thermoset 6008 offers an easy flow around densely packed and intricate circuitry. The encapsulating compound offers good insulation, protecting components from moisture and vibrations while offering an easy pour reducing or eliminating de-aeration. The Circalok 6008 has low shrinkage and will allow more electronic units to be housed in smaller units. For additional information including Technical Data Sheets or Material Safety Data Sheets contact Krayden, Inc. Authorized Distributor of LORD Thermoset products.