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ML 3549 30CC SYR CSP UNDERF FP8015-V19

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ML 3549 30CC SYR CSP UNDERF FP8015-V19

ML 3549 30CC SYR CSP UNDERF
  • Buy 90 for $68.60 each and save 17%
  • Buy 360 for $65.00 each and save 21%
  • Buy 900 for $61.37 each and save 26%
Product may have an MOQ, listed price may vary. A representative will contact you if so.
$82.04

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Details
Loctite 3549 is a one component, heat cure, fast flow, reworkable underfill
Additional Information
SKU FP8015-V19
Former SKU LTFP8015V19
Part Number LOCTITE 3549 30CC SYR
Product Information designed for BGA and CSP devices, provides protection for solder joints
Technical Data Sheet DOWNLOAD PRODUCTS TDS
Cure Type Heat Cure
Chemistry Epoxy
Product Category Encapsulants
Product Type Potting Material
Manufacturer LOCTITE HENKEL
Brand LOCTITE
Industry Electronics
Manufacturer SKU 910487
Related Search Terms Loctite 3549