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LOCTITE ECCOBOND UF 3810 50ML M1623008

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LOCTITE ECCOBOND UF 3810 50ML M1623008

LOCTITE ECCOBOND UF 3810 50ML
  • Buy 51 for $113.28 each and save 8%
  • Buy 501 for $108.38 each and save 12%
Product may have an MOQ, listed price may vary. A representative will contact you if so.
$123.08

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Details
Loctite UF3810 CSP/BGA Underfill is an epoxy hybrid, with low viscosity
Additional Information
SKU M1623008
Former SKU HYUF3810 50ML-K
Part Number LOCTITE ECCOBOND UF 3810
Product Articles

Loctite UF3810

Loctite UF3810 is a halogen-free, high TG, one component material that cures quickly when it is introduced to heat helping reduce stress in products. UF3810 from Hysol is an adhesive with the capability of being used as an underfill on chip scale packages and BGA applications.

Product Information with a pot life of 3 days and a shelf life of 6 months
Technical Data Sheet DOWNLOAD PRODUCTS TDS
Chemistry Epoxy
Product Category Encapsulants
Product Type Potting Material
Manufacturer LOCTITE HENKEL
Brand LOCTITE
Industry Aerospace
Manufacturer SKU 1623008
Related Search Terms Loctite UF3810