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LOCTITE 383 THERMALLY CONDUCTIVE GRAY OUTPUT ADHESIVE 25 ML SYRINGE

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LOCTITE 383 THERMALLY CONDUCTIVE GRAY OUTPUT ADHESIVE 25 ML SYRINGE

Loctite 383 thermally conductive output adhesive is a system designed for connecting heat manufacturing components to heat sinks. It is used for the bonding of transistors, transformers, and other heat generating electronics to printed circuit board, heat sinks and assemblies.
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$49.84

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Details
Loctite 383 thermally conductive adhesive is a system made for connecting heat manufacturing components to heat sinks.It provides high structural strength to many electronic assemblies and outstanding heat dissipation for very thermally delicate components. It is typically used for the bonding of transistors, transformers, and other heat generating electronics to printed circuit board, heat sinks and assemblies. It features a volume resistance of 5.2×10^11, a surface resistance of 8.6×10^13, and a dielectric constant/dissipation factor of 14.92/0.05 at 100 Hz. It also has a dielectric constant/dissipation factor of 14.26/0.03 at 1 KHz and a dielectric constant/dissipation factor of 12.34 / 0.06 at 1 MHz.
Additional Information
Additional Color, Sizes and Packaging

Loctite 383 Thermally Conductive Adhesive 25 ML Kit
Loctite 383 Thermally Conductive Adhesive 300 ML Cartridge

SKU M17098
Part Number ML 383 OUTPUT 25ML SYR
Literature

Henkel Thermal Management Material     Loctite Thermal Management Materials     Dow Corning Product Guide Electronics Solutions Brochure

Product Articles

More product information regarding Loctite 383 Thermally Conductive Adhesive 

Loctite 383 thermally conductive adhesive is a system aimed at connecting heat manufacturing components to heat sinks. It provides outstanding heat dissipation for very thermally delicate components.

Product Information

Loctite 383 output key feature is its excellent thermal properties. It provides outstanding heat dissipation for very thermally delicate components. It has a volume resistance of 5.2×10^11, a surface resistance of 8.6×10^13, and a dielectric constant/dissipation factor of 14.92/0.05 at 100 Hz.

 

Typical Use:
Bonding of transistors, transformers, and other heat generating electronics to printed circuit board, heat sinks and assemblies.
 
Appearance:
Gray Paste
 
Viscosity:
High
 
Cure:
Room Temperature
 
Application:
Bonding
 
Strength:
High
 
Elongation at break:
7.8%
 
Specific Gravity:
1.5 @ 25°C
 
Lap Shear Strength:
551 psi
 
Tensile Strength:
2,320 psi
 
Coefficient of Thermal Expansion:
71 x 10^-6
 
 
Coefficient of Thermal Conductivity:
0.602 w/mk
 
Volume Resistivity:
5.2 x 10^11
 
Surface Resistivity:
8.6 x 10^13
 
Specific Gravity:
1.5 @ 25°C
 
Product Specific Info:
If a manufacturer certification is required, please request a quote
 
Technical Data Sheet

DOWNLOAD PDF FOR LOCTITE 383 TDS

Application One Part
Attribute Thermally Conductive
Characteristics Paste
Cure Type Room Temperature Cure
Chemistry Acrylic
Packaging Syringe
Product Category Adhesives
Product Type Activator
Manufacturer LOCTITE HENKEL
Brand LOCTITE
Industry Electronics, Lighting
Manufacturer SKU 135255
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