Details
EPIBOND® 215 A/B Adhesive is an extrudable, two-component, room temperature curing epoxy structural adhesive designed for service temperatures up to 300°F (149°C). This adhesive is suitable for bonding a wide variety of materials such as metals, composites, and many other dissimilar substrates. The combination of high peel strength and high shear makes this adhesive well suited for aerospace and other demanding applications.
Additional Information
| SKU | HT4531508 |
|---|---|
| Part Number | EPIBOND 215 A/B 130LB PAIL KIT |
| Packaging | Kit |
| Product Category | Adhesives |
| Manufacturer | HUNTSMAN |
| Brand | HUNTSMAN |
| Industry | Aerospace |
| Manufacturer SKU | 4531508 |
