Details
Dowsil SC 102 Thermally Conductive Compound is a white, non-curing, silicone paste that is used to gap fill for material among electronic heat source and heat sinks. This compound is calculated to provide well-organized thermal transfer for the cooling of electronic modules used in power source, automotive applications, and computers. Dowsil SC 102 is a thermally conductive compound that allows high-temperature steadiness along with low bleed. This grease-like, silicone material is deeply filled with heat-conductive metal oxides.
Additional Information
SKU | DC2535980 |
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Former SKU | DCSC1021KG |
Part Number | DC SC 102 COMPOUND 1KG |
Product Information | Dowsil SC 102 Thermally Conductive Compound is a white, non-curing, and non-flowing material. This compound is one-part with no need for ovens or curing, and it conducts heat away from critical components. Dowsil SC 102 is a thermally conductive grease-like silicone compound. This material promotes high thermal conductivity, low bleed, and high-temperature stability. Typical Use:
Dowsil SC 102 Compound is designed to provide efficient thermal transfer for the cooling of PCB system assembly modules used in computer, power supply, and automotive applications. A cooler device allows for more efficient operation and better reliability over the life of the device.
One Part or Two Part:
One Part
Color:
White
Viscosity:
29000 cP, 29 Pa-sec
Bleed:
0.14 %
NVC (Non Volatile Content):
99.7 %
Dielectric Strength:
50 volts/mil, 2 kV/mm
Specific Gravity (Uncured):
2.4
Volume Resistivity:
2E+16 Ohm-cm
Dissipation Factor at 50 Hz:
2E-02
Dielectric Constant at 50 Hz:
4.0
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Technical Data Sheet | DOWNLOAD DOWSIL SC 102 TDS |
Application | One Part |
Attribute | Thermally Conductive |
Color | White |
Characteristics | Grease |
Chemistry | Silicone |
Product Category | Thermally Conductive Materials |
Product Type | Compound, Potting Material |
Manufacturer | DOW |
Brand | DOW |
Industry | General Industrial |
Manufacturer SKU | 2535980 |
Related Search Terms | Dow corning, thermal, conductive, compound, applications, non-curing, low bleed, gap fill, silicone, heat source, grease |