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DOWSIL ME 6820 MICROELECTRONIC ENCAPSULANT 30 GR DC4121602

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DOWSIL ME 6820 MICROELECTRONIC ENCAPSULANT 30 GR DC4121602

DC ME 6820 30 GR
  • Buy 3 for $80.06 each and save 8%
  • Buy 5 for $74.34 each and save 15%
  • Buy 10 for $69.39 each and save 20%
Product may have an MOQ, listed price may vary. A representative will contact you if so.
$86.73

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Details
Dowsil ME 6820 Microelectronic Encapsulant is a die encapsulant for wire bond packing. This product can be used for protection of sensitive components and has low levels of ionic impurities.
Additional Information
SKU DC4121602
Part Number DC ME 6820 30GR
Product Information Dowsil ME 6820 absorbs stress from CTE mismatch for improved reliability performance with a low modulus of elasticity and no by-product during cure.
Technical Data Sheet

DOWNLOAD DOWSIL ME 6820 TDS

Application One Part
Characteristics Rubber
Cure Type RTV
Specifications MIL-A-46146
Chemistry Polymer, Silicone
Product Category Adhesives, Sealants
Manufacturer DOW
Brand DOW
Manufacturer SKU 4121602
Related Search Terms Dow Corning 3145, Dow Corning 3145 adhesive, Dow Corning 3145 adhesive sealant