Details
Dowsil ME 6820 Microelectronic Encapsulant is a die encapsulant for wire bond packing. This product can be used for protection of sensitive components and has low levels of ionic impurities.
Additional Information
| SKU | DC4121602 |
|---|---|
| Part Number | DC ME 6820 30GR |
| Product Information | Dowsil ME 6820 absorbs stress from CTE mismatch for improved reliability performance with a low modulus of elasticity and no by-product during cure. |
| Technical Data Sheet | |
| Application | One Part |
| Characteristics | Rubber |
| Cure Type | RTV |
| Specifications | MIL-A-46146 |
| Chemistry | Polymer, Silicone |
| Product Category | Adhesives, Sealants |
| Manufacturer | DOW |
| Brand | DOW |
| Manufacturer SKU | 4121602 |
| Related Search Terms | Dow Corning 3145, Dow Corning 3145 adhesive, Dow Corning 3145 adhesive sealant |
