Details
Dowsil ME 6820 Microelectronic Encapsulant is a die encapsulant for wire bond packing. This product can be used for protection of sensitive components and has low levels of ionic impurities.
Additional Information
SKU | DC4121602 |
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Part Number | DC ME 6820 30GR |
Product Information | Dowsil ME 6820 absorbs stress from CTE mismatch for improved reliability performance with a low modulus of elasticity and no by-product during cure. |
Technical Data Sheet | |
Application | One Part |
Characteristics | Rubber |
Cure Type | RTV |
Specifications | MIL-A-46146 |
Chemistry | Polymer, Silicone |
Product Category | Adhesives, Sealants |
Manufacturer | DOW |
Brand | DOW |
Manufacturer SKU | 4121602 |
Related Search Terms | Dow Corning 3145, Dow Corning 3145 adhesive, Dow Corning 3145 adhesive sealant |