Details
DOWSIL 1-4173 is a solvent-free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heated curing, self-leveling, flowable, good thermal conductivity, and has high tensile strength.
Additional Information
| SKU | DC2852497 |
|---|---|
| Former SKU | DC1-41733.3LBCART |
| Part Number | DC 1-4173 TC ADHESIVE 1.5KG |
| Product Articles |
Dowsil 1-4173 is a thermally conductive, flowable adhesive with a high tensile strength. This innovative material is suitable for a wide variety of applications including base plate attach, adhering lids and housings, bonding integrated circuit substrates and much more... |
| Product Information | with good thermal conductivity, heat cure and tensile strength |
| Technical Data Sheet | |
| Application | One Part |
| Attribute | Thermally Conductive |
| Cure Type | Heat Cure |
| Specifications | UL 94 V-0 |
| Chemistry | Polymer, Silicone |
| Product Category | Adhesives, Thermally Conductive Materials |
| Manufacturer | DOW |
| Brand | DOW |
| Industry | Electronics, Lighting |
| Manufacturer SKU | 2852497 |
| Related Search Terms | Dow Corning 1-4173, Dow Corning 1-4173 thermally conductive adhesive |
