Details
63 WS809 89.8-4-M19 6IN/700GM
Additional Information
| SKU | AP148985 |
|---|---|
| Former SKU | 148985-K |
| Part Number | 63 WS809 89.8-4-M19 6IN/700GM |
| Product Articles |
Alpha WS-809 is a water soluble solder paste developed for a wide range of SMT processes. This engineered solder paste dries at temperature up to 19-29 degrees Celsius and it exhibits excellent resistance to hot and cold slumping. |
| Product Information | Alpha® ALPHA WS-809 is a SnPb, water-soluble solder paste which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required.
Typical Use:
ALPHA WS-809 is formulated for both standard and fine feature pitch stencil printing.
Shelf Life and Storage:
ALPHA WS-809 should be stored refrigerated upon receipt at (0 – 10) oC / (32°-50)°F. This will be sufficient to maintain a nominal shelf life. ALPHA WS-809 should be permitted to reach room temperature before unsealing its package prior to use. Room temperature storage for sealed containers should not exceed 14 days. The shelf-life of refrigerated ALPHA WS-809 is 6 months
Solder Ball:
Preferred - Pass IPC J-STD-005
Viscosity:
1,550 – 2,550 poise
Stencil Life:
8 hours @ 30-50% RH, 75-80°F (24-27°C)
10 Day Copper Corrosivity:
Pass, (post-cleaning) IPC J-STD-004A
Paste Density:
4.4 g/cc typical
Slump:
Pass IPC J-STD-005
Pass, cold slump after 10 min RH and hot slump after 10 min at 150°C at 25%, 50%, and 75% RH
|
| Technical Data Sheet | DOWNLOAD PRODUCTS TDS |
| Characteristics | Paste |
| Product Category | Solder Materials |
| Manufacturer | ALPHA SOLDER |
| Brand | ALPHA SOLDER |
| Industry | Electronics, General Industrial |
| Manufacturer SKU | 148985 |
