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ALPHA 63 WS809 SOLDER PASTE 89.8-4-M19 6IN/700GM AP148985

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ALPHA 63 WS809 SOLDER PASTE 89.8-4-M19 6IN/700GM AP148985

63 WS809 89.8-4-M19 6IN/700GM
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63 WS809 89.8-4-M19 6IN/700GM
Additional Information
SKU AP148985
Former SKU 148985-K
Part Number 63 WS809 89.8-4-M19 6IN/700GM
Product Articles

Alpha WS-809 Solder Paste

Alpha WS-809 is a water soluble solder paste developed for a wide range of SMT processes. This engineered solder paste dries at temperature up to 19-29 degrees Celsius and it exhibits excellent resistance to hot and cold slumping.

Product Information

Alpha® ALPHA WS-809 is a SnPb, water-soluble solder paste which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required.

 

Typical Use:
ALPHA WS-809 is formulated for both standard and fine feature pitch stencil printing.
 
Shelf Life and Storage:
ALPHA WS-809 should be stored refrigerated upon receipt at (0 – 10) oC / (32°-50)°F. This will be sufficient to maintain a nominal shelf life. ALPHA WS-809 should be permitted to reach room temperature before unsealing its package prior to use. Room temperature storage for sealed containers should not exceed 14 days. The shelf-life of refrigerated ALPHA WS-809 is 6 months
 
Solder Ball:
Preferred - Pass IPC J-STD-005
 
Viscosity:
1,550 – 2,550 poise
 
 
Stencil Life:
 8 hours @ 30-50% RH, 75-80°F (24-27°C) 
10 Day Copper Corrosivity:
Pass, (post-cleaning) IPC J-STD-004A
 
Paste Density:
4.4 g/cc typical
Slump:
Pass IPC J-STD-005
Pass, cold slump after 10 min RH and hot slump after 10 min at 150°C at 25%, 50%, and 75% RH
 
Technical Data Sheet DOWNLOAD PRODUCTS TDS
Characteristics Paste
Product Category Solder Materials
Manufacturer ALPHA SOLDER
Brand ALPHA SOLDER
Industry Electronics, General Industrial
Manufacturer SKU 148985