Details
Alpha's ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental conditions. The ALPHA OM-5100 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability.
Additional Information
| SKU | AP143390 |
|---|---|
| Former SKU | 143390-K |
| Part Number | 63 OM5100 90-3-M13 6IN 700GM |
| Product Information | Alpha® OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental conditions. The ALPHA OM-5100 activation system has been optimized to enhance joint solderability, limit soldering defects and maintaining long term reliability. Minimizing defects requires robust and repeatable processes, equipment and materials.
Typical Use:
Wide reflow profile window enables soldering of lead free components with this tin lead paste. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC 305 BGA spheres
Apperance:
Clear, Colorless Flux Residue. 63Sn/37Pb alloy
Solder Ball:
Pass < 10 count (62Sn/36Pb/2Ag, 63Sn/37Pb alloy) Pass IPC J-STD-005
Viscosity:
90% metal load designated M13 for printing. Malcom Spiral Viscometer; J-STD-005
Stencil Life:
>8 hours @ 50%RH, 23 o C (74°F)
Corrosivity:
Copper Corrosion Test Pass, ROL0 = J-STD Classification (Corrosivity Cu Mirror Pass (L))
Halide Content:
Halide free (by titration). Passes Ag Chromate Test
Slump:
Hot Slump & Cold Slump
Pass IPC J-STD-005
Pass DIN Standard 32 513, 5.3
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| Technical Data Sheet | DOWNLOAD PRODUCTS TDS |
| Color | Clear |
| Characteristics | Paste |
| Chemistry | Alloy |
| Product Category | Solder Materials |
| Manufacturer | ALPHA SOLDER |
| Brand | ALPHA SOLDER |
| Manufacturer SKU | 143390 |
