The story:
Krayden partnered with a company looking for a material for bonding large and small die integrated circuits with variable thermal expansion as well in automated assembly processes. We recommended Loctite Ablestik 965-1L. The material was reliable and very effective with a good level of contamination resistivity.
| What is the application? | Bonding large and small die integrated circuits with variable thermal expansion as well in automated assembly processes. |
| What issues was the end-user having? | Needed electrically conductive and shock stress absorption. Good bond line was also required. |
| What material was used to solve the issue? | LOCTITE ABLESTIK 965-1L |
| Why did this material work better than other materials? | Good level of contamination resistivity. |
| Was this material lower cost than other materials? | No. |
| Did this material improve the process? | Yes. Allowed rapid manufacturing. Increased by 10% – 15% |
| What industry/market was this material used in? | Aerospace, avionics and space bound units. |
