Krayden partnered with a company looking for a material for bonding large and small die integrated circuits with variable thermal expansion as well in automated assembly processes. We recommended Loctite Ablestik 965-1L. The material was reliable and very effective with a good level of contamination resistivity.
|What is the application?||Bonding large and small die integrated circuits with variable thermal expansion as well in automated assembly processes.|
|What issues was the end-user having?||Needed electrically conductive and shock stress absorption. Good bond line was also required.|
|What material was used to solve the issue?||LOCTITE ABLESTIK 965-1L|
|Why did this material work better than other materials?||Good level of contamination resistivity.|
|Was this material lower cost than other materials?||No.|
|Did this material improve the process?||Yes. Allowed rapid manufacturing. Increased by 10% – 15%|
|What industry/market was this material used in?||Aerospace, avionics and space bound units.|