DOWSIL TC-2022 Thermally Conductive Adhesive

Adhesive, All Products, Bonding, Dow Corning, Electronics, one-part, silicone, Transportation

DOWSIL TC-2022 Thermally Conductive Single Component Adhesive DOWSIL TC-2022, formerly Dow Corning TC-2022, is a single component, high tensile strength, thermally conductive adhesive. The innovative product requires no mixing, has no added solvents, can be used with heat-sensitive substrates and components. Dow TC-2022 is suitable for bonding integrated circuit boards, heat sink attach, adhering lids…