Circalok 6008 Potting Compound by LORD

The epoxy resin, Circalok 6008 is a filled low viscosity used for general purposes as an encapsulating and potting compound for electronics.  The LORD Thermoset 6008 offers an easy flow around densely packed and intricate circuitry. The encapsulating compound offers good insulation, protecting components from moisture and vibrations while offering an easy pour reducing or…

Structural Adhesive and Magnet Bonder by Permabond

Krayden, Inc. Introduces the Permabond TA459 magnet adhesive that is non-corrosive to electrically conductive surfaces including copper.  Used with the Initiator 43, the magnet bonding adhesive is the preferred method in the assembly of magnets in motors and electronics due to the reliable and consistent results produced.  The Permabond TA459 is a fast and durable…

New Acrylic Adhesive Maxlok by LORD Adhesives

Announcing a new acrylic adhesive with versatile substrate bonding capabilities  manufactured by the LORD Corporation.  This cutting edge technology allows surfaces to be mated more than once allowing for a more forgiving and user friendly application process. For use in various industries such as; solar, transportation, shipping and construction.  The new Maxlok acrylic adhesive comes…

Thermally Conductive Adhesive 3-6751 by Dow Corning

The Dow Corning 3-6751 thermally conductive adhesive is used for bonding heat sinks to electronic devices and also for bonding printed circuit boards to substrates.  The 3-6751 adhesive is a gray, two-part kit that is heat curable with a UL94 V-0 rating.  The low viscosity, low modulus quality of DC 3-6751 allows a more intimate…

Henkel Loctite Frekote 55-NC Release Agent

The Frekote 55 NC is an improved version of the Frekote 44-NC offering quicker evaporation time and less odor.  Loctite Frekote 55-NC has a polymeric base with only a minimal adjustment in the solvent blend compared to the Frekote 44-NC.  This release agent offered by Henkel Frekote is ideal when molding due to the non-transferring…