TECHNOMELT

THE LEADER IN LOW PRESSURE MOLDING MATERIAL

Electronic Protection with Proven
Henkel Solutions

Technomelt low-pressure molding solutions deliver superior sealing adhesion and
excellent temperature and solvent resistance. Technomelt low-pressure molding offers
measurable improvement because the entire operation takes place at lower pressure,
cycle time is short and fragile circuitry is not damaged

Trending Products

TECHNOMELT 947C BM1217927 TECHNOMELT 947C BM1217927
$120.51
TECHNOMELT PA 6300 BM1398258 TECHNOMELT PA 6300 BM1398258
$480.96
TECHNOMELT 8651 BM1318118 TECHNOMELT 8651 BM1318118
$76.83
TECHNOMELT 8370 BM1554389 TECHNOMELT 8370 BM1554389
$71.76
Technomelt Thermally Conductive Material

Technomelt Thermally Conductive Material

Keep it cool with Technomelt Thermally Conductive Material

  • ABOUT TECHNOMELT HOT MELT ADHESIVES

Henkel’s innovative line of TECHNOMELT solutions delivers advanced sealing adhesion and solvent/temperature resistance. The low pressure molding materials also deliver outstanding electrical insulation and allow for a unique design that goes far beyond fit, form and function of traditional encapsulating materials. The simplicity of TECHNOMELT is a key advantage: Operation takes place at low pressure, cycle times are short, and delicate circuitry is not damaged, delivering measurable improvements over traditional encapsulating processes. It is the ultimate hot mold polyamide that protects electronics from the harshest environments including UV exposure, extreme thermal cycling, and high humidity.

Technomelt Circuit Protection

Technomelt Circuit Protection

View the full line of Technomelt Low pressure molding materials for circuit board protection

FEATURED LITERATURE

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    Technomelt Improve Productivity and Reliability

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    Technomelt Low Pressure Molding Overview

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    Technomelt Low Pressure Molding Adhesives

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    Technomelt AS 8998 Overview

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    Technomelt Low Pressure Molding Solutions

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    Technomelt AS 8998 Surface Insulation Test

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    Technomelt LPM Brochure

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    Technomelt TC 50

KRAYDEN UPDATES

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    For jobs requiring rapid repair, Epibond 1559-1 A/B and C/D are an ideal choice for epoxy adhesives due to their quick set times, particularly at colder temperatures. These adhesives are both self-extinguishing pastes that are made up of two separate parts and are suitable for a multitude of bonding applications. Epibond 1559-1 A/B and C/D…

  • Dow Corning TC-3040

    Dow Corning TC-3040 Thermally Conductive Gel Dow Corning TC-3040 is a single-component, heat curable, thermally conductive gel used in microelectronics thermal interface applications. This product exhibits high thermal conductivity, has improved heat dissipation, and enables reliable performance. It offers versatile curing options and is composed of polydimethylsiloxane. Application methods include manual or automated. The color…

  • Fastweld 10 A/B Epoxy Adhesive

    Huntsman Fastweld 10 A/B Rapid Setting Epoxy Adhesive Suitable for repair work and bonding small parts, Fastweld 10 is great for general purpose shop applications. This rapid-setting epoxy adhesive offers a user-friendly one-to-one mix ratio by volume or weight. The two-component paste is able to create strong bonds in a short period of time. Huntsman’s…

  • Loctite 3979 Light Cure Adhesive

    Loctite 3979 Translucent Light Cure Acrylic Adhesive Loctite 3979 is a single component, UV-visible light cure, acrylic adhesive designed for medical bonding applications. This advanced material fluoresces red under UV light and cures rapidly by being exposed to UV light or visible light of the appropriate wavelength. Loctite 3979 uncured appearance is translucent to hazy…

  • Loctite 5404 Silicone Adhesive

    Loctite 5404 Thermally Conductive Silicone Adhesive For bonding circuit board substrates, metallic heat sinks, and ceramic chips, Loctite 5404 is an ideal selection for an adhesive. This silicone based adhesive was designed for applications that include bonding numerous different types of devices that generate heat to their corresponding heat sinks. This product offers low resistance…

  • HumiSeal 1C49HVF Silicone Encapsulant

    HumiSeal 1C49HVF Solvent-Free Silicone Encapsulant   Demonstrating excellent flexibility, HumiSeal 1C49HVF is a solvent-free and VOC-free silicone encapsulant designed to protect printed circuit assemblies from moisture and other environmental elements. This material fluoresces under UV light, making it easy to inspect and it is repairable. HumiSeal 1C49HVF is a high build, moisture curing encapsulant, and…