Buy Loctite FP 4450
Loctite FP 4450 is a low stress, high purity, heat cure, black epoxy encapsulant formulated for the protection of semiconductor devices. Some of the typical package application of this material include chip-on-board, hybrid circuits, automotive applications, IC memory cards, BGA and pin grid arrays. The operating temperature of Loctite FP 4450 is between -65 to 150 degrees Celsius. This material offers excellent pressure pot performance on live devices up to approximately 500 hours with no failures.
Loctite Hysol FP 4450 has good moisture resistance and excellent chemical resistance. This advanced material exhibits relatively high flow with exceptional high temperature performance. At a temperature of 125 degrees Celsius the cure time is approximately 30 minutes, at a temperature of 165 degrees Celsius the cure time is approximately 90 minutes. This is an estimated time for curing; times may vary based on cure conditions. The pot life ofLoctite FP4450 is 3 days at a temperature of 25 degrees Celsius and the gel time is 12 minutes at a temperature of 121 degrees Celsius.
It is very important to understand the proper application methods and dangers when using Loctite FP 4450. This product is not recommended to be used in a pure oxygen rich system. It also should not be selected as a sealant for chlorine and other strong oxidizing materials. The shelf life of this encapsulant is 9 months when it is stored in a tightly stored container at a temperature of -40 degrees Celsius. Do not re-freeze this product; once it is thawed re-freezing may change the characteristics of the epoxy encapsulant. It is also not recommended to open the container until the contents reach a temperature of 25 degrees Celsius. For the best results, dispense the material onto the substrate warmed to 80 degrees Celsius. Once Loctite FP 4450 is removed from the container it is not recommended to return the product back into the container because it may be contaminated during use. For more information regarding the safe use of this epoxy encapsulant, refer to Loctite FP 4450 MSDS.
Loctite Hysol FP 4450 is an advanced epoxy encapsulating material manufactured for the protection of bare semiconductor devices. Henkel is a global leader in manufacturing some of the most technologically advanced materials for the electronics industry. Loctite FP 4450 is an advanced epoxy that can be used in a variety of applications. For more information regarding Loctite FP4450, contact Krayden Inc., Henkel’s certified adhesive, sealant and specialty chemical distributers. Also, refer to Loctite FP 4450 TDS.