HumiSeal 1C49HVF Solvent-Free Silicone Encapsulant
Demonstrating excellent flexibility, HumiSeal 1C49HVF is a solvent-free and VOC-free silicone encapsulant designed to protect printed circuit assemblies from moisture and other environmental elements. This material fluoresces under UV light, making it easy to inspect and it is repairable. HumiSeal 1C49HVF is a high build, moisture curing encapsulant, and can be cured at elevated or room temperatures. This product complies with RoHS Directive 2011/65/EC, and is recognized under UL File Number E105698.
The density of HumiSeal 1C49HVF Encapsulant is 0.97 ± 0.03 g/cm³ per ASTM D1475, and its viscosity is 27500 ± 7500 centipoise per Fed-Std-141, Meth. 4287. The VOC of this material is 0 grams/liter, and the recommended curing conditions are 24 hours at room temperature or 20 minutes at 76°C. It is recommended that during this cure time an open pan of water be placed in the oven. The working time for HumiSeal 1C49HVF Encapsulant is 10 minutes at room temperature, and the tack-free time is 20 minutes at room temperature. The time that is required for this silicone encapsulant to reach optimum properties is 7 days.
The recommended stripper for HumiSeal 1C49HVF Silicone Encapsulant is HumiSeal Stripper 1090. The shelf life for this product is 12 months from the date of manufacture if kept at room temperature, and flammability is V-0 per UL94. The shore hardness for HumiSeal 1C49HVF Silicone Encapsulant is 25, A, cured 72 hours at room temperature, per ASTM D2240, and the volume resistivity is 4.34 x 10^18 ohm-cm. If more data is required, please see the HumiSeal 1C49HVF Technical Data Sheet.
HumiSeal 1C49HVF Characteristics:
Viscosity, per Fed-Std-141, Meth. 4287
Working Time, at RT
Tack free time, at RT
Recommended Curing Conditions
Time required to Reach Optimum Properties
Shelf Life at Room Temperature, DOM
27500 ± 7500 centipoise
24 hrs @ RT or 20 min @ 76°C
For HumiSeal 1C49HVF to be utilized successfully, it is of the highest importance that the substrate is clean prior to application. Problems leading to assembly failure can occur if contamination of any form exists beneath the encapsulant. Potential contaminants include (but are not limited to) dirt, moisture, grease, wax, and flux residues. Suitable testing should take place to confirm the reliability and compatibility of HumiSeal 1C49HVF when used on “no clean” assembly materials. This product has been designed to work effectively without any added thinners or solvents. For further application instruction, please contact a Krayden Technical Representative.
HumiSeal 1C49HVF Encapsulant can be applied by automated needle dispensing such as an Asymtek SC-300 in monofilament mode, a PVA FC100 needle valve, hand syringes, or other automated dispensing equipment. This material may also be applied by brush, and the consistency of the completed coating will depend on the density of the component as well as the operator’s technique. When encapsulating printed circuit assemblies, HumiSeal 1C49HVF Silicone Encapsulant is an ideal choice as it delivers excellent flexibility and strong protection against environmental elements. Not only does this product offer ease of inspection, but it is entirely repairable as well. For additional information on product benefits, please contact Krayden, an authorized distributor of HumiSeal encapsulants.