Loctite 383 thermally conductive adhesive is a system aimed at connecting heat manufacturing components to heat sinks. It provides outstanding heat dissipation for very thermally delicate components. Loctite 383 thermal adhesive also provides high structural strength to many electronic assemblies. It is typically used for the bonding of transistors, transformers, and other heat generating electronics to printed circuit…
LOW PRESSURE MOLDING
Henkel’s innovative line of TECHNOMELT solutions delivers
advanced sealing adhesion and solvent/temperature resistance.
The low pressure molding materials also deliver outstanding electrical
insulation and allow for a unique design that goes far beyond fit, form,
and function of traditional encapsulating materials.