Henkel offers a wide array of Loctite brand structural adhesives designed to solve the toughest bonding, surface preparation and protection, repair, and potting challenges in the aerospace industry.
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Henkel offers a large array of Loctite brand paste adhesives and specialty resins systems for MRO applications. Improve employee productivity as well as safety, reduce hazardous waste, and enjoy custom packaging options for MRO.
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Henkel, the leading solution provider for adhesives, sealants and functional coatings worldwide, uses high-quality BERGQUIST thermal management products—like BERGQUIST TCLAD, BERGQUIST SIL PAD and BERGQUIST LIQUI-BOND—to offer technological solutions for electronics.
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Loctite has developed a wide variety of phase change thermal interface material technology which is a unique wax-based system that is solid when cool and liquid once its phase change temperature is achieved
Technomelt AS 8998 Masking Material is evaluated by Henkel to determine surface insulation resistance (SIR) properties of any residues that may remain after the material is removed from the board. Evaluated for SIR per IPC-TM-650 220.127.116.11 criteria.
Test combs on IPC-B-24 Rev. B, Technomelt AS 8998, IPC-TM-650 18.104.22.168,
Technomelt Molding products offer a gentle encapsulation with adhesive molding compounds producing the ultimate seal and robust molding protection. Some of the benefits include shorter cycle times, replaces both the housing and potting in one operation, reduced molding material consumption, and safe encapsulation of fragile components
Technomelt PA 7841, Technomelt PA 7846, Technomelt 7848 Black, Technomelt PA 7873, Technomelt PA 7878, Technomelt 7833, Technomelt PA 7838, Technomelt PA 7852, Technomelt 7857, Technomelt PA 7808, Technomelt 7808 Black, Technomelt AS 7875
Technomelt Low Pressure Process Flow delivers superior sealing adhesion and excellent solvent and temperature resistance. It is an innovative technology to serve the increasing demands of circuit board protection in the electronics market.
Technomelt PA 673, Technomelt PA 678, Technomelt PA 682, Technomelt PA 687, Technomelt PA 633, Technomelt PA 638, Technomelt PA 652, Technomelt PA 657, Technomelt PA 6208, Technomelt PA 6208 Black, Technomelt PA 341, Technomelt PA 641, Technomelt PA 646, Technomelt PA 648, Technomelt AS 5375
Technomelt Low pressure molding overview brief description and the benefits of using a hot melt polyamide on electronic components. The technology allows for unique design beyond the form-fit-function of traditional materials. Technomelt offers complete watertight encapsulation with excellent temperature and solvent resistance.
Hot melt Polyamide, UL 94-V0 rated, PA 648, PA 341, PA 658, MM 2384, AS 4226, PA 668, PA 2692, PA 633, PA 638, PA 641, PA 646, PA 652, PA 657, PA 673, PA 678, TC 50
Henkel's Technomelt low-pressure molding solution delivers excellent sealing adhesion and exceptional temperature and solvent resistance. Technomelt operation takes place at low pressure delivering measuring improvements over that of traditional potting or encapsulating processes. Technomelt is a lightweight material that has excellent adhesion to multiple surfaces.
Technomelt PA 633, Technomelt PA 652, Technomelt PA 653, Technomelt PA 6208, Technomelt PA 638, Technomelt PA 657, Technomelt PA 658, Technomelt PA 6208 Black, Technomelt TC 50, Technomelt PA 673, Technomelt PA 682, Technomelt PA 2692, Technomelt PA 678, Technomelt PA 687, Technomelt PA 641, Technomelt PA 646, Technomelt PA 341, Technomelt PA 2384, Technomelt AS 5375, Technomelt AS 4226, Technomelt PA 668 Clear, Technomelt PA 649, Technomelt PA 6344, Technomelt AS 8998
Technomelt TC 50 is the first ever thermally conductive low pressure molding material. It combines the low pressure, protective benefits of all Technomelt Materials with new, thermally conductive functional capabilities.
Well suited for Camera Modules, Power Supplies, LED Drivers, Solar Inverters, Automotive Electronic Power Systems