BETAFLOOR Pourable flooring and sealing technology combines ease of use, fast installation, effective sealing and durable performance. The end result is a watertight, repairable and fully sealed floor that provides low VOC emissions.
pourable flooring technology, pourable sealing technology, fast installation, easy to use, effective sealing, durable performance, watertight, betafloor, flooring system
Part of a growing portfolio of acoustic solutions from Dow Automotive Systems, BETAFOAM low-density formulations form high-performance acoustical seals to prevent noise from resonating in vehicle cavities.
high-performance acoustical seals, polyurethane foam, blocking foam, acoustic cavity-sealing, three-dimensional cavity sealing, water leak prevention, gas intrusion prevention
VORAFORCE epoxy systems are industry leading resin transfer molding (RTM) solutions offered to meet varying application temperature requirements. They combine extended infusion times at low viscosity with ultra-fast cure capability for higher-volume production of structural components.
Voraforce, epoxy system, resin transfer molding, RTM, extended infusion times, low viscosity, fast curing, high volume production, internal mold release, carbon fiber composite production, wet compression
Dow Automotive BETAMATE structural adhesive is a single or two component, room temperature or heat curable, epoxy adhesive that eliminates pretreatment steps and makes it easy for joining metals and composites
Dow Automotive offers a wide variety of products to meet modern lightweight designs in the automotive industry. The bonding technologies offered are well suited for bonding dissimilar and new products that meet the lightweight standard.
Replace VOC and hazardous air pollutant solvents used in electronics manufacturing with Dow Corning brand OS fluids. These environmentally acceptable and user friendly fluids can be used for stripping conformal coatings, coating dilution, coating applications, board preparation, and equipment clean-up.
dow corning, os fluids, coating dilution, conformal coating stripper, conformal coating, environmentally friendly os fluid, OS-10, OS -20, OS-30, OS-120
Dow Corning EA-7100 is a new Silicone Adhesive designed for automotive electronics. This innovative adhesive bonds with diverse substrates including new and alternative materials. Dow Corning EA-7100 is considered for use in assembly of electronics housings from plastic and/or metals and for attaching connectors, electronic control units or sensors on substrates.
Dow Corning EG-3810 Dielectric Gel is a one part, heat cure, thermally stable silicone gel. Offers long lasting, reliable device performance in extreme conditions and it protects delicate leads against thermal cycling
Potting material for electronics, Dielectric Gel, Dow Corning EG-3810
Dow Corning offers a highly transparent encapsulant that offers long-lasting protection for sensitive LED electronics. Dow Corning EI-1184 Encapsulant is efficient, reliable, and provides outstanding weatherability.
By utilizing great electrical properties, heat resistance, cold resistance and stress relieving properties, Dow Corning’s silicone products for electronics are contributing significantly to the improved reliability of electronic parts, semiconductors and electronic equipment as it becomes increasingly smaller and sophisticated.
Dow Corning provides solutions for LED assembly including optical grade silicone encapsulants, sealants, adhesives and conformal coatings. The silicone materials are designed to deliver purity, and physical
744 RTV Sealant, Q3-6093, SE 9186, 3-6265, 866, EA-6054, 3-1953, 3-1965, 1-2577, 1-4105, Q1-4010, 3-4207, SE 1740, SE 9187L, Sylgard 160, 170, 184, 567
Dow Corning offers a line of lubricants capable of challenging harsh environments and extreme temperatures. Selection guide for greases, oils, pastes, compounds, dispersion products, anti-friction coatings and more.
As one of the leading material houses in the world, Dow Corning offers many options across the solar value chain so that you can select the optimal solutions for your solar module and assembly operations.
Dow Corning Silicone products for lamps of many benefits including thermal stability, transparency, photo stability, and enhanced protection. Thermal interface materials, LED chip encapsulants, PCB, sealants for dust and moisture protection and more
Dow Corning Silicone based sealants last longer and are more versatile than most organic polymer sealants. They offer durability and are a tough rubbery solid with excellent performance characteristics
Silicone products from Dow Corning enable new designs and applications for LED lighting. They offer advanced materials for next-generation lighting designs by optimizing efficiency, resisting yellowing, protecting sensitive LED electronics and by pushing the boundaries of LED design
LED silicone, conformal coating, thermal interface materials, LED chip encapsulant, reflector materials, LED, LED lamps, luminaries, Thermally conductive.
Dow Corning materials enable higher performing solar and wind energy devices that allows improved sustainability. Some benefits include Vacuum insulation panels, structural glazing, weather resistant sealants and more.
With more than 70 years of experience developing silicone-based solutions for cutting-edge applications, Dow Corning offers today’s LED industry unmatched experience and know-how for LED lamp and luminaire assembly. We bring more than just an industry-leading portfolio of assembly materials – such as thermal pottants, thermal interface materials, adhesives and sealants, and conformal coatings. As a dedicated innovation partner, we also bring proven process and application expertise, a reliable global supply base, and world-class customer service. If your application involves the manufacture, assembly, protection or enhancement of LED lighting devices, you will likely find with Dow Corning a materials or process solution tailored to your needs.
Dow Corning TC-2022 is a single component, thermally conductive, heat cure adhesive whose heat cure rate is rapidly accelerated with heat. Well suited for bonding integrated circuit substrates, heat sink attach, sensors, engine, power and transmission control units.
Substrates well suited to be bonded with Dowsil TC-2022 includes AlClad, FR4, PBT. Thermally conductive adhesive, Low temperature cure for temperature sensitive components, Reduces mechanical Clamping.
Dow Corning Thermal Phase Change Material PCM-250 is a thermally conductive phase change material that melts at temperatures above 50 degrees Celsius. It has the performance of grease, the ease of pads and the reliability of silicone.