DOWSIL TC-2022, formerly Dow Corning TC-2022, is a single component, high tensile strength, thermally conductive adhesive. The innovative product requires no mixing, has no added solvents, can be used with heat-sensitive substrates and components. Dow TC-2022 is suitable for bonding integrated circuit boards, heat sink attach, adhering lids and housings. The adhesive is composed of…
Generations of Innovation and Transformation
Established in 1943 developing and exploring the potential of silicone, Dow has become a global leader in
innovated silicone technologies. For over 120 years, Dow has succeeded in excelling from science start-up
innovations and has continuously transformed itself for the opportunities of each era.