Dow Corning TC-3040 Thermally Conductive Gel
Dow Corning TC-3040 is a single-component, heat curable, thermally conductive gel used in microelectronics thermal interface applications. This product exhibits high thermal conductivity, has improved heat dissipation, and enables reliable performance. It offers versatile curing options and is composed of polydimethylsiloxane. Application methods include manual or automated. The color of Dow Corning TC-3040 is gray.
Dow Corning TC-3040 Gel is a material whose cure rate is rapidly accelerated with heat. Specific gravity is 2.4 and viscosity is 90,000 Cp. Room temperature working time is approximately 24 hours and it is 2.5 on the thixotropic index. The material has a thermal conductivity of 4.3 W/Mk and modules of 18 kPa. The cure time is as follows, 30 minutes at 150°C, 60 minutes at 125°C, and 120 minutes at 100°C. Cure schedules reflect time once the bond line and material reach the listed temperature.
This advanced thermally conductive encapsulant has demonstrated excellent compatibility with common surfaces used in flip chip packaging as well as different types of heat spreader and sink options. However, some heat cure silicones can be subjected to cure inhibition when certain chemicals are present. Dow Corning TC-3040 Thermal Interface material provides a reduction in thermal impedance while maintaining its key features. Dow Corning TC-3040 Thermally Conductive Gel has won The R&D 100 Award 2016. The material is shipped in 10 cc or 30 cc syringes. For more information about this innovative product, Ask an Expert from Krayden.
Before using, it is strongly recommended to read and fully understand the Dow Corning TC-3040 Safety Data Sheet. Shelf life will be clearly indicated on the product label. Keep containers tightly sealed with a head of air minimized. Exposure to moisture could reduce the strength of adhesion and cause bubbles. Encapsulant materials which contain a higher level of fillers that can be stored for longer periods of time need to be agitated or rolled to prevent separation. The product has not been tested nor deemed suitable to be used for medical or pharmaceutical applications.
Dow Corning TC-3040 Thermal Interface Material Features and Benefits:
• Heat curable
• High thermal conductivity
• Low modulus
• Enables reliable performance
• One-part formulation
• Improved heat dissipation
• No mixing of components needed
Dow Corning TC-3040 Thermally conductive Gel is a single component, low modulus heat cure encapsulant whose cure rate is rapidly accelerated with heat. You can find availability or application methods, ask Krayden, and a technical representative will assist you. More helpful information can also be found on the Dow Corning TC-3040 Thermally Conductive Adhesive Technical Data Sheet.